This is the fourth edition of the world's most comprehensive and useful database on the effects of reagents on plastic and elastomeric materials. Contains over 194,000 distinct records.
 
AUDIENCE
Engineers, researchers and technicians in the plastics industry who are designing parts that come into contact with chemical reagents.
 
DESCRIPTION
The world's first and most trusted source of chemical resistance data is about to be released in its 4th Edition. The Chemical Resistance of Plastics and Elastomers database is the most complete source of information ever gathered on how more than 200 material types react to over 4,500 exposure media, both common and exotic. Now with over 194,000 records, the fourth edition of Chemical Resistance has become the most powerful tool any plastics engineer, researcher, or technician can use. Hard to find information is normalized to quickly provide answers to your questions and the highly regarded PDL rating is included for quick answers as to whether the material is suitable for further research. Records are organized in four ways:

Extensive data are given for exposure conditions and results of exposure. All data are presented in tabular format.

Exposure Conditions
   Temperature
   Time of Exposure
   Stress Level of Specimen
   Concentration of Reagent
   Special Notes
Test Results
   Tensile Strength Retained
   Elongation Retained
   Weight Change
   Dimensional Change
   Appearance Change
   Resulting Stress Cracks
   Qualitative Assessment
   PDL Resistance Rating
   Resistance Notes
Also Included
   Material Details
   CAS Registry Numbers
   Glossary of Terms
   Reagent & Temperature Sort
   Trade Name Index
   Metadata
Data Presented As
   Tabular Data
   Multiple Sorts

 

AUTHOR / EDITOR INFORMATION
William A. Woishnis is Founder of William Andrew Inc. and cofounder of Knovel Corporation. He graduated with honors from Worcester Polytechnic Institute with a degree in Mechanical Engingeering. After college, he worked with Hewlett Packard Company in Palo Alto, California.